Products Solutions My Intel Support Support Home Product Specifications Chipsets Search specifications Add to Compare Mobile Intel(R) CM246 Chipset Specifications Essentials Export specifications Essentials Product Collection Intel(R) C240 Series Chipsets Supplemental Information Memory Specifications Code Name Processor Graphics Status Expansion Options Launch Date I/O Specifications Bus Speed Products formerly Coffee Lake Launched Q2'18 8 GT/s DMI3 Package Specifications Advanced Technologies Security & Reliability Ordering and Compliance Lithography TDP 14 nm 3W Recommended Customer Price Supports Overclocking Yes Supplemental Information Embedded Options Available Yes Memory Specifications # of DIMMs per channel 2 Processor Graphics Intel(R) Clear Video Technology # of Displays Supported Yes 3 Expansion Options PCI Support NO PCI Express Revision 3.0 PCI Express Configurations Max # of PCI Express Lanes x1, x2, x4 24 I/O Specifications # of USB Ports USB Configuration USB Revision 14 10 Total USB 3.1 Ports - Up to 6 USB 3.1 Gen 2 Ports - Up to 10 USB 3.1 Gen 1 Ports 14 USB 2.0 Ports 3.1/2.0 Max # of SATA 6.0 Gb/s Ports 8 RAID Configuration 0/1/5/10 Integrated LAN Integrated MAC Integrated Wireless Intel(R) Wireless-AC MAC Package Specifications Package Size 25mm x 24mm Low Halogen Options Available See MDDS Advanced Technologies Intel(R) Virtualization Technology for Directed I/O (VT-d) Yes Intel(R) vProTM Platform Eligibility Yes Intel(R) ME Firmware Version 12 Intel(R) HD Audio Technology Yes Intel(R) Rapid Storage Technology Yes Intel(R) Rapid Storage Technology enterprise Yes Intel(R) Stable Image Platform Program (SIPP) Yes Intel(R) Smart Sound Technology Yes Security & Reliability Intel(R) Trusted Execution Technology Yes More support options for Mobile Intel(R) CM246 Chipset Product Support Downloads and Software Support Community Warranty and Replacement Need more help? Contact support Give Feedback All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems. Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction. Refer to Datasheet for formal definitions of product properties and features. "Announced" SKUs are not yet available. Please refer to the Launch Date for market availability. This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration. The Recommended Customer Price ("RCP") is pricing guidance for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation. System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used. Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment. WARNING: Altering clock frequency and/or voltage may: (i) reduce system stability and useful life of the system and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications. Intel assumes no responsibility that the processor, including if used with altered clock frequencies and/or voltages, will be fit for any particular purpose. For more information, visit http://www.intel.com/content/www/us/en/gaming/overclocking/overclocking-intel-processors.html Company Information Newsroom (c) Intel Corporation Our Commitment Communities Investor Relations Contact Us Jobs Terms of Use *Trademarks Privacy Cookies Supply Chain Transparency Site Map